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Build binary MCU packages as tarballs (#5900)

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This includes xtensa for s3, esp riscv targets, as well as thumbv7
for STM32.

Co-authored-by: Olivier Goffart <olivier.goffart@slint.dev>
This commit is contained in:
Simon Hausmann 2024-08-22 16:16:55 +02:00 • committed by GitHub
parent 7f62249bc3
commit d413fd5217
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GPG key ID: B5690EEEBB952194
3 changed files with 119 additions and 2 deletions
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4
api/cpp/CMakeLists.txt
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@ -479,6 +479,10 @@ else()
set(CPACK_SYSTEM_NAME "${CMAKE_SYSTEM_NAME}-${CMAKE_SYSTEM_PROCESSOR}")
endif()
if (Rust_CARGO_TARGET)
set(CPACK_SYSTEM_NAME "${CPACK_SYSTEM_NAME}-${Rust_CARGO_TARGET}")
endif()
include(CPack)
if(SLINT_BUILD_TESTING)